LSPcManufacturer image: Nexa3DNexa3D XiP
Desktop resin printer documented through Nexa3D manuals and retained support.
Source reviews: 2026-10-16.
Specifications are reported claims, not independent test results.
The details that matter.
Published specifications for this model. Follow a field's source for its configuration and measurement conditions; older fields refer to the profile's reference list.
| Introduction year | Not verified |
|---|---|
| Model family | XiP |
| Process | LSPc |
| Build envelope (X × Y × Z) | Not verified |
| Nominal box volume | Not verified |
| Enclosure | Not verified |
| Materials cited in this profile | Photopolymer resin |
| Manufacturer listing status | Unknown |
| Regional stock and price | Check the manufacturer |
| Market grouping | Desktop · editorial grouping |
Technical specifications
| Brochure Build Volume (mm) | 190 × 115 × 210 Sources: XiP brochure — October 2022 |
|---|---|
| Support Faq Build Volume (mm) | 190 × 120 × 210 Sources: XiP frequently asked questions |
| Brochure Specification Build Volume (mm) | 195 × 115 × 210 Specification-table value on page 2; conflicts with the page 1 marketing value. Sources: XiP — official product documentation |
| XY pixel pitch (µm) | 52 Sources: XiP — official product documentation |
| Wavelength (nm) | 405 Sources: XiP — official product documentation |
| Lcd Diagonal (inches) | 9.3 Sources: XiP — official product documentation |
| Lcd Format | Monochrome 4K Panel format is separate from pixel pitch. Sources: XiP — official product documentation |
| Machine dimensions (mm) | 420 × 350 × 530 Sources: XiP — official product documentation |
| Display (inches) | 5.5 Sources: XiP — official product documentation |
| Connectivity | Ethernet, USB, Wi-Fi Sources: XiP — official product documentation |
| File Formats | STL, OBJ Formats listed in the 2022 brochure; not an assertion about all later NexaX versions. Sources: XiP — official product documentation |
| Resin Feed | Gravity-fed cartridge with vat-level sensing Sources: XiP — official product documentation |
| Vat Retention | Electromagnetic clamping Sources: XiP — official product documentation |
| Resin Identification | NFC bottle and vat/membrane Sources: XiP — official product documentation |
| Operating Ambient Temperature (°C) | 20–25 Sources: XiP — official product documentation |
| Operating Relative Humidity | Below 70% Sources: XiP — official product documentation |
| Power Supply | 100–240 VAC, 50/60 Hz Sources: XiP — official product documentation |
Three manufacturer-reported envelope values are retained with their document contexts. None is presented as a verified universal fit volume; current new-machine supply was not established.
Resin system
XiP combines LSPc exposure with an Everlast-2 membrane, quick-release build plate and cartridge-fed resin. Built-in spill containment and stackable vats support resin changes.
Conflicting envelope figures
The October 2022 brochure states 190 × 115 × 210 mm on its first page and 195 × 115 × 210 mm in the specification table. A single definitive fit envelope remains unset until the exact hardware/document revision is confirmed.
Explore the model family.
An exact introduction year has not been established in the reviewed sources.
Family: XiP · Historical model
Explore Nexa3D through the generationsRead this with the specifications
Canonical build volume remains unset. The October 2022 brochure gives 190 × 115 × 210 mm on its first page and 195 × 115 × 210 mm in its specification table; the retained support FAQ records 190 × 120 × 210 mm. Document or machine-revision applicability remains unresolved.
A larger nominal envelope does not establish better print quality. Fit depends on the configuration, usable area, supports, and orientation.