Micro laser sinteringSource: 3D MicroPrint3D MicroPrint DMP70
Micro laser sintering system for metal components.
Source reviews: 2026-10-17.
Specifications are reported claims, not independent test results.
The details that matter.
Published specifications for this model. Follow a field's source for its configuration and measurement conditions; older fields refer to the profile's reference list.
| Introduction year | Not verified |
|---|---|
| Model family | DMP |
| Process | Micro laser sintering |
| Build envelope (X × Y × Z) | 60 × 60 × 45 mm |
| Nominal box volume | 0.16 L · calculated from the envelope |
| Enclosure | Not verified |
| Materials cited in this profile | Metal powder |
| Manufacturer listing status | Manufacturer product page listed; stock and regional availability not established |
| Regional stock and price | Check the manufacturer |
| Market grouping | Industrial · editorial grouping |
Technical specifications
| Laser Power | 50 or 200 W |
|---|---|
| Layer Thickness | 1–15 µm |
| Spot Diameter Max Um | 30 |
System and configuration
DMP70 updates the DMP60 platform with revised controls and integrated gas cleaning. The stated laser options are 50 or 200 W.
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An exact introduction year has not been established in the reviewed sources.
Family: DMP · Listing status only
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Exact manufacturer model documentation reviewed; configuration and regional supply require confirmation with the maker.
A larger nominal envelope does not establish better print quality. Fit depends on the configuration, usable area, supports, and orientation.
